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Innerlayer surface treatment
 Black/Brown Oxide process
 Jetcoat process (Oxide replacement)

Lamination application- High Tg base material
 It is intended to increase the adhesive strength between the inner layer and prepreg.
 It is named based on the board color of its surface treatment.
 Compare to black oxide, it has less processing steps and is pink-ring free.
 Oxide replacement has good strength, preventing if from peeling even after heatshocking.
 The brown oxide prevents delamination when enhancing the adhesive strength between prepreg and Cu.
 The Jetcoat HT process is able to maintain its high peel strength at law Etch Rate.


002DLD (Black Oxide Process & Jetcoat Process Direct Laser Drilling)
Less process steps
Better registration
Cost reduction
Advantage: 
Excellent surface uniformity
Consistent weight gain
Superior anti-scratching capability
Vertical Process-Direct Laser Drilling
 Black Oxide LD Process
 Excellent surface uniformity
 Consistent weight gain
 Superior anti-scratching capability
 Consistent Hole size
 Minimizing the undercut


Horizontal Process-Direct Laser Drilling
 Black Oxide LD-H Process
 Controlled crystal growth
 Easy to operate thinner PCB
 Provided the most stable and most uniform surface treatment
 Significantly less surface copper thickness loss after process
 Best for MSAP application with ultra thin copper clad



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